Solder Ball

Global and China Solder Ball Market Research by Company, Type & Application 2013-2025

Report ID: HeyReport 33387 | Number of pages: 68 | Publish Date: Aug 2019 | Category: Chemicals and Materials
Summary
In integrated circuit packaging, a solder ball, also a solder bump (often referred to simply as "ball" or "bumps") is a ball of solder that provides the contact between the chip package and the printed circuit board, as well as between stacked packages in multichip modules. The Solder Ball can be placed manually or by automated equipment, and are held in place with a tacky flux. 
Market Segment as follows:
By Type
    Lead Solder Ball
    Lead Free Solder Ball
By Application
    BGA
    CSP & WLCSP
    Flip-Chip & Others
By Company
    Senju Metal
    DS HiMetal
    MKE
    YCTC
    Nippon Micrometal
    Accurus
    PMTC
    Shanghai hiking solder material
    Shenmao Technology
The main contents of the report including:
Section 1:
Product definition, type and application, global and China market overview;
Section 2:
Global and China Market competition by company;
Section 3:
Global and China sales revenue, volume and price by type;
Section 4:
Global and China sales revenue, volume and price by application;
Section 5:
China export and import;
Section 6:
Company information, business overview, sales data and product specifications;
Section 7:
Industry chain and raw materials;
Section 8:
SWOT and Porter's Five Forces;
Section 9:
Conclusion.
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Table of Content
1 Market Overview
    1.1 Market Segment Overview
        1.1.1 Product Definition
        1.1.2 Market by Type
            1.1.2.1 Lead Solder Ball
            1.1.2.2 Lead Free Solder Ball
        1.1.3 Market by Application
            1.1.3.1 BGA
            1.1.3.2 CSP & WLCSP
            1.1.3.3 Flip-Chip & Others
    1.2 Global and China Market Size
        1.2.1 Global Overview
        1.2.2 China Overview
2 Global and China Market by Company
    2.1 Global
        2.1.1 Global Sales by Company
        2.1.2 Global Price by Company
    2.2 China
        2.2.1 China Sales by Company
        2.2.2 China Price by Company
3 Global and China Market by Type
    3.1 Global
        3.1.1 Global Sales by Type
        3.1.2 Global Price by Type
    3.2 China
        3.2.1 China Sales by Type
        3.2.2 China Price by Type
4 Global and China Market by Application
    4.1 Global
        4.1.1 Global Sales by Application
        4.1.2 Global Price by Application
    4.2 China
        4.2.1 China Sales by Application
        4.2.2 China Price by Application
5 China Trade
    5.1 Export
    5.2 Import
6 Key Manufacturers
    6.1 Senju Metal
        6.1.1 Company Information
        6.1.2 Product Specifications
        6.1.3 Business Data (Capacity, Sales Revenue, Volume, Price, Cost and Margin)
    6.2 DS HiMetal
    6.3 MKE
    6.4 YCTC
    6.5 Nippon Micrometal
    6.6 Accurus
    6.7 PMTC
    6.8 Shanghai hiking solder material
    6.9 Shenmao Technology
7 Industry Upstream
    7.1 Industry Chain
    7.2 Raw Materials
8 Market Environment
    8.1 SWOT
    8.2 Porter's Five Forces
9 Conclusion
Figure Lead Solder Ball Market Size and CAGR 2013-2018 (Million USD)
Figure Lead Solder Ball Market Size and CAGR 2013-2018 (Volume)
Figure Lead Solder Ball Market Forecast and CAGR 2019-2025 (Million USD)
Figure Lead Solder Ball Market Forecast and CAGR 2019-2025 (Volume)
Figure Lead Free Solder Ball Market Size and CAGR 2013-2018 (Million USD)
Figure Lead Free Solder Ball Market Size and CAGR 2013-2018 (Volume)
Figure Lead Free Solder Ball Market Forecast and CAGR 2019-2025 (Million USD)
Figure Lead Free Solder Ball Market Forecast and CAGR 2019-2025 (Volume)
Figure BGA Market Size and CAGR 2013-2018 (Million USD)
Figure BGA Market Size and CAGR 2013-2018 (Volume)
Figure BGA Market Forecast and CAGR 2019-2025 (Million USD)
Figure BGA Market Forecast and CAGR 2019-2025 (Volume)
Figure CSP & WLCSP Market Size and CAGR 2013-2018 (Million USD)
Figure CSP & WLCSP Market Size and CAGR 2013-2018 (Volume)
Figure CSP & WLCSP Market Forecast and CAGR 2019-2025 (Million USD)
Figure CSP & WLCSP Market Forecast and CAGR 2019-2025 (Volume)
Figure Flip-Chip & Others Market Size and CAGR 2013-2018 (Million USD)
Figure Flip-Chip & Others Market Size and CAGR 2013-2018 (Volume)
Figure Flip-Chip & Others Market Forecast and CAGR 2019-2025 (Million USD)
Figure Flip-Chip & Others Market Forecast and CAGR 2019-2025 (Volume)
Figure Global Solder Ball Market Size and CAGR 2013-2017 (Million USD)
Figure Global Solder Ball Market Size and CAGR 2013-2017 (Volume)
Figure Global Solder Ball Market Forecast and CAGR 2019-2025 (Million USD)
Figure Global Solder Ball Market Forecast and CAGR 2019-2025 (Volume)
Figure China Solder Ball Market Size and CAGR 2013-2017 (Million USD)
Figure China Solder Ball Market Size and CAGR 2013-2017 (Volume)
Figure China Solder Ball Market Forecast and CAGR 2019-2025 (Million USD)
Figure China Solder Ball Market Forecast and CAGR 2019-2025 (Volume)
Figure Global Market Sales Revenue Share by Company in 2017
Figure Global Market Sales Volume Share by Company in 2017
Figure China Market Sales Revenue Share by Company in 2017
Figure China Market Sales Volume Share by Company in 2017
Figure Global Market Sales Revenue Share by Type in 2017
Figure Global Market Sales Volume Share by Type in 2017
Figure China Market Sales Revenue Share by Type in 2017
Figure China Market Sales Volume Share by Type in 2017
Figure Global Market Sales Revenue Share by Application in 2017
Figure Global Market Sales Volume Share by Application in 2017
Figure China Market Sales Revenue Share by Application in 2017
Figure China Market Sales Volume Share by Application in 2017
Figure Industry Chain Overview
Figure Solder Ball SWOT List
Figure Solder Ball Porter's Five Forces